i am here at roy electronics in northern italy and i'm going to share with you now the pcb assembly
process as it starts from the burbot pcbs to the end customers four electronics have implemented a
very advanced industry 4.0 pcb assembly shop floor as you can see there are hardly any operators
in this production floor because they have chosen to implement a very high level of automation
this is the shop floor of the future let's go have a look
the burr board goes into the laser marking machine the machine marks the unique serial number
which comes from the erp and reports to the output file that the value iot can then collect
the data the serial number will enable us to track this specific board and know exactly
what happened to it at roy the serial numbers are generated by the erp and are unique to each pcb
the screen printer applies the paste through the stencil each job has a different stencil
which is planned with value process preparation it must be precise per product and per revision
at this station we can expect a relatively high rate of defects
it is very sensitive to environment condition temperature humidity this is the reason for
many tests and inspection after this stage with valor material management we can conduct stencil
verification by scanning the stencil barcode and reporting the exact stencil and paste we have used
the solder paste inspection machine referenced as spi tests the quality of the printer to verify
that everything was printed according to the plan and there is paste only where it should be
the spi will run the test program and report the findings in a file including pass fail as well as
measurements this data is later on collected by valor iot roy are three type of pick and place
machines a fast pick and place machine a machine with a camera for small and subtle components
when accuracy is highly important and a very strong machine with high pressure for boards
that require force in implementing its components having different pick and place machines is
typical to many manufacturers it allows for high accuracy and flexibility valor process preparation
can help in generating the assembly programs valuarity manufacturing connects to the pick
and place machine and can collect data regarding machine utilization valor material management
helps manage the material on the machine and replacement of material when it's consumed
at the visual inspection station operators can validate that the
correct components were placed on the board before continuing in the manufacturing process
valor process preparation can create the documentation which
will define for the operator what should be inspected at this stage
here the soldering is done the plant for the oven is referred to as an oven profile the
reflow oven is divided into several chambers the speed through each chamber can be different and
each chamber can have a different temperature value iot manufacturing connects to the reflow
oven and receives information regarding the actual temperature and speed of the oven
at this station we wish to ensure that each component was placed correctly
in the right angle and that the soldering is good
valor process preparation can help us prepare a test program so that the exact location where
the pins contact the pads will be examined at this point the smt process is complete
following the smt process we have additional placement technologies such as through-hole and
manual assembly at the through-hole station at roy we can see that the through-hole components
are placed manually on the pcb but they're then soldered in a selective soldering oven
there are two methods which are used to perform electrical tests on the pcb bed of nails for high
volume which allows for shorter time of testing but requires expensive development of fixtures or
flying probe for high mix small volume it takes longer to program the flying probe and run the
test but is much easier to handle new products valor process preparation can help plan the
fixture of the bed of nail as well as generate a program for the flying probe machine in addition
valor iot will collect data from the different testers including the different electrical
measurement as well as the pass fail all valor manufacturing solutions have been integrated
into the camstar electronics suite data is sent to the mes which now runs the entire process
for large bga components we need to check that the pins reach the right layer these pins are usually
behind the component and therefore cannot be tested with aoi machines
in this case we use an x-ray to take an x-ray image of the pcb
and make sure that the connectivity and the soldering is adequate
now we can actually test the functionality of the completed product the preference is always
to find issues through the different processes and avoid finding defects at the last stage of
the functional test here mechanical parts are assembled manually or by a robot at this point
the product assembly is complete that's it the product is ready to be delivered we can package it
and send it to the end customer the pcb assembly process has been completed now that we've learned
how pcbs are made come and join us in leading this industry siemens ingenuity for life