hello everyone today i would like to
present our work sewer tape a transfer
based technique to help fabricate
circuits on a wide range of materials
for worser tile real work purposes my
name is ting yu chung
currently a phd student at georgia
institute of technology
supervised by professor hung zhuo and
gregory about
and i am very honored to present this
work on behalf of our team
this work is also a collaboration among
georgia tech university of tokyo and the
carnegie mellon university
in the past decade digital fabrication
tools such as laser cutters 3d printers
or cnc
routers have benefited not only
manufacturers but also researchers
makers
or even children to fabricate their own
designs rapidly
at the same time these tools allow users
to play with a wide range of materials
for example 3d printer can print
plastics polymers or even food
ingredients
in an easy fast and compact way our
motivation here is to
further extend the benefits of digital
fabrication to make electronics
with an accessible fabrication process
and diverse material selections at the
same time
researchers have already introduced
works for digital fabrication of
electronics in hci and
ubiquitous computing fields for example
like inkjet printing
screen printing or even 3d printing
among all these methods
inkjet printing is showing the brightest
future due to its
great ink conductivity and compact
fabrication process
for example instant print circuits use
the commodity inkjet printer
and the sewer nanoparticle inks to print
conductive traces
well for ink there are two main curing
methods
which require either heat sintering or
chemical sintering process
as post treatments the heat sintering
has drawbacks of requiring actual
heating tools and that can potentially
damage the printing substrates
so the chemical sintering process shows
a brighter future
since there is almost no requirements
for the poster treatments
however conventional chemical sintering
process has been limited to the
specially coated paper or pt fume
this substrate limitation has heavily
restricted people's design
choices here we purpose sewer tape which
is leveraging the existing printed
circuits techniques by simply
transferring the printed circuits
to a wide range of adhesive materials
with different purposes
transparent ultra flexible heat
resistive or even water soluble
in the following of this presentation i
will mainly discuss in more details
about the fabrication process testing
results and
applications the fabrication has three
simple steps
printing transferring and assembling for
printing
similar as most of the inkjet printing
circuit messes
we just need to load the conductive
nanoparticle ink to the inkjet printer
and print our design for the transfer
step we need to simply apply the
targeting adhesive substrates
to peel off the printed pattern achieved
from the printing step
after the transfer we can mount the
electronic components with
conductive glues or adhesives
for the transfer step we would like to
highlight the retransferability of our
technique
where the conventional printed traces
can be easily scratched and hard to
repair
well for our transfer technique we can
simply re-transfer a new trees on the
damaged spot
as here we are demonstrating a risk
transfer of a conductive trace to light
up an led
for the testing we have done a thorough
study for what substrates we can
transfer from
and what substrates we can transfer to
for the substrate that we can transfer
from
most of the commodity photo papers and
the mitsubishi pd film
exhibit successful transferability and
perform
fairly good conductivity after transfer
for the substrates we can transfer to
we have a search and tested most of the
tapes and the commonly used adhesive
materials in the market
to evaluate the electrical performance
after the transfer
most of the materials show promising
conductivity and indicated repeating
force from 0.3 newton per centimeter
to 6 newton per centimeter would be
proper to transfer
we also tested seven different materials
and three
different geometries to exemplify most
of the daily surfaces or
objects that we can apply the
transferred conductive trace to
enabled by our sewer tape we can
fabricate
functional circuits for different
purposes we can simply transfer the
pattern to heat resistive kept on tape
to fabricate a temperature sensor which
cannot be achieved by the conventional
photo paper or ped sub trees
or we can directly transfer a conductor
pattern onto a soft robotic material
to rapidly fabricate a bending sensor
for soft robots
we also demonstrated a flexible
multi-layer led which is powered
wirelessly
we can also transfer a pattern onto
scotch tape to make a flexible extension
panel for mobile devices
the transfer technique also has a
modular nature
which allow people to transfer different
patterns onto the same substrates
one by one here we demonstrated seven
christmas tree patterns are transferred
separately onto a single sheet of
pdms sheet where the modular nature also
enable a fabrication dimension beyond
the conventional printing paper
you can also check our paper to see more
technical details
and i would like to thank for all the
team members and supervisors again for
their support
and efforts