Broadwell is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture
due in late 2014, following Intel's tick-tock principle as the next step in semiconductor
fabrication. Broadwell will adopt the Multi-Chip Package
design and it will be used in conjunction with Intel 9 Series chipsets.
As of July 2014, Broadwell CPUs are available to Intel's hardware partners in sample quantities.
Expected variants Broadwell is expected to be launched in four
major variants: BGA package:
Broadwell-Y: System-on-chip; 4.5 W and 3.5 W TDP classes, for tablets and certain ultrabook-class
implementations. GT2 GPU will be used, while maximum supported memory is 8 GB of LPDDR3-1600.
These will be the first chips to roll out, and are expected for Q3/Q4 2014. At Computex
2014, Intel announced that these chips will be branded as Core-M.
Broadwell-U: SoC; two TDP classes – 15 W for 2+2 and 2+3 configurations, and 28 W
for the 2+3 configuration. Designed to be used on motherboards with the PCH-LP chipset
for Intel's ultrabook and NUC platforms. Maximum supported memory is either 16 GB of DDR3L-1600,
or 8 GB of LPDDR3-1600. The 2+2 configuration is scheduled for Q4 2014, while the 2+3 is
estimated for Q1 2015. Broadwell-H: 37 W and 47 W TDP classes,
for motherboards with HM86, HM87, QM87 and the new HM97 chipsets for "all-in-one" systems,
mini-ITX form-factor motherboards, and other small footprint formats. It may come in two
different variants, as single and dual chips; the dual chips will have GT3e and GT2 GPU,
while a single chip will have GT3e GPU. Maximum supported memory is 32 GB of DDR3L-1600.
These are scheduled for Q2 2015.
LGA 1150 socket: Broadwell-H: Quad-core desktop version with
GT3e, expected to be released during Q2 2015.
LGA 2011-3 socket: Broadwell-EP: To be marketed as Xeon E5-2600
v4 etc., while using the C610 Wellsburg chipset platform. Up to 18 cores and 36 threads, up
to 45 MB of total cache and 40 PCI Express 3.0 lanes, with 70–160 W TDP classes. Maximum
supported memory speed is quad-channel DDR4-2400. Broadwell-EX: Brickland platform, for mission-critical
servers. Intel QuickPath Interconnect is expected to be updated to version 1.1, enabling seamless
scaling beyond eight-socket systems. Maximum supported memory speeds are expected to be
DDR3-1600 and DDR4-3200.
Instruction set extensions Broadwell will introduce some instruction
set architecture extensions: Intel ADX: ADOX, ADCX and MULX for improving
performance of arbitrary-precision integer operations
RDSEED for generating 16-, 32- or 64-bit random numbers according to NIST SP 800-90B and 800-90C
PREFETCHW instruction. New features
Broadwell's Intel Quick Sync Video hardware video decoder adds VP8 hardware decoding support.
Also, it will have two independent bit stream decoder rings to process video commands on
GT3 GPUs; this will allow one BSD ring to process decoding and the other BSD ring to
process encoding at the same time. List of Broadwell processors
List of announced mobile processors is as follows:
When a cooler or quieter mode of operation is desired, this mode specifies a lower TDP
and lower guaranteed frequency versus the nominal mode.
This is the processor's rated frequency and TDP.
When extra cooling is available, this mode specifies a higher TDP and higher guaranteed
frequency versus the nominal mode. Roadmap
On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration
at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a
30 percent improvement in power use over the Haswell chips released in mid-2013.
On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release
of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously
announced Haswell refresh. This will coincide with the release of Intel's 9-series chipset,
which may be required for Broadwell processors due to a change in power specifications for
its LGA 1150 socket. On 18 May 2014, Reuters quoted Intel's CEO
promising that Broadwell-based PCs will be on shelves for the holiday season, but probably
not for the back-to-school shopping. Mobile CPUs are expected in Q4 2014 and high-performance
quad-core CPUs in 2015. The mobile CPUs will benefit from the reduced energy consumption
of the die shrink. On 18 June 2014, Intel told CNET that while
some specialized Broadwell-based products would be out in Q4 2014, "broader availability"
would only happen in 2015. As of July 2014, Broadwell CPUs are available
to Intel's hardware partners in sample quantities. See also
List of Intel CPU microarchitectures References