Haswell is the codename for a processor microarchitecture developed by Intel as the successor to the
Ivy Bridge architecture. It uses a 22 nm process. Intel officially announced CPUs with this
microarchitecture on June 4, 2013 at Computex Taipei 2013. With Haswell, Intel introduced
a low-power processor designed for convertible or "hybrid" Ultrabooks, having the Y suffix.
Intel demonstrated a working Haswell chip at the 2011 Intel Developer Forum.
Haswell CPUs are used in conjunction with the Intel 8 Series chipsets and Intel 9 Series
chipsets.
Design The Haswell architecture is specifically designed
to optimize the power savings and performance benefits from the move to FinFET transistors
on the improved 22 nm process node. Haswell has been launched in three major forms:
Desktop version: Haswell-DT Mobile/Laptop version: Haswell-MB
BGA version: 47 W and 57 W TDP classes: Haswell-H
13.5 W and 15 W TDP classes: Haswell-ULT 10 W TDP class: Haswell-ULX
Notes ULT = Ultra Low TDP; ULX = Ultra Low eXtreme
TDP Only certain quad-core variants and BGA R-series
SKUs receive GT3e integrated graphics. All other models have GT3, GT2 or GT1 integrated
graphics. See also Intel HD and Iris Graphics for more details.
Due to the low power requirements of tablet and UltraBook platforms, Haswell-ULT and Haswell-ULX
are only available in dual-core. All other versions come in dual- or quad-core variants.
Performance Compared to Ivy Bridge:
Approximately 8% better vector processing performance.
Up to 6% faster single-threaded performance. 6% faster multi-threaded performance.
Desktop variants of Haswell draw between 8% and 23% more power under load than Ivy Bridge.
A 6% increase in sequential CPU performance. Up to 20% performance increase over the integrated
HD4000 GPU. Total performance improvement on average is
about 3%. Around 15 °C hotter than Ivy Bridge, while
clock frequencies of 4.6 GHz are achievable. Technology
Features carried over from Ivy Bridge 22 nm manufacturing process
3D tri-gate transistors Micro-operation cache capable of storing 1.5 K
micro-operations 14- to 19-stage instruction pipeline, depending
on the micro-operation cache hit or miss Mainstream variants are up to quad-core
Native support for dual-channel DDR3 memory, with up to 32 GB of RAM on LGA 1150 variants
64 KB L1 cache and 256 KB L2 cache per core A total of 16 PCI Express 3.0 lanes
New features Wider core: fourth ALU, third AGU, second
branch prediction unit, deeper buffers, higher cache bandwidth, improved front-end and memory
controller New instructions, gather, BMI1, BMI2, ABM
and FMA3 support). The instruction decode queue, which holds
instructions after they have been decoded, is no longer statically partitioned between
the two threads that each core can service. New sockets and chipsets:
LGA 1150 for desktops, and rPGA947 and BGA1364 for the mobile market.
Z97 and H97 chipsets for the Haswell Refresh and Broadwell, in Q2 2014.
LGA 2011-3 with X99 chipset for the enthusiast-class desktop platform Haswell-E.
Intel Transactional Synchronization Extensions, on selected models
Hardware graphics support for Direct3D 11.1 and OpenGL 4.3.
DDR4 for the enterprise/server variant and for the Enthusiast-Class Desktop Platform
Haswell-E Variable Base clock like LGA 2011.
Four versions of the integrated GPU: GT1, GT2, GT3 and GT3e, where GT3 version has 40
execution units. Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs. GT3e version
with 40 EUs and on-package 128 MB of embedded DRAM, called Crystalwell, is available only
in mobile H-SKUs and desktop R-SKUs. Effectively, this eDRAM is a Level 4 cache; it is shared
dynamically between the on-die GPU and CPU, and serving as a victim cache to the CPU's
Level 3 cache. Optional support for Thunderbolt technology
and Thunderbolt 2.0 Fully integrated voltage regulator, thereby
moving some of the components from motherboard onto the CPU.
New advanced power-saving system; due to Haswell's new low-power C6 and C7 sleep states, not
all power supply units are suitable for computers with Haswell CPUs.
37, 47, 57 W thermal design power mobile processors.
35, 45, 65, 84, 95 and 130–140 W TDP desktop processors.
15 W TDP processors for the Ultrabook platform leading to reduced heat, which results in
thinner as well as lighter Ultrabooks, but the performance level is lower than the 17 W
version. Shrink of the Platform Controller Hub, from
65 nm to 32 nm.
Expected server processors features Release by the end of 2014.
Haswell-EP variant, with up to 14 cores and marketed as Xeon E5 2600 v3 series.
Haswell-EX variant, with 18–20 cores. A new cache design.
Up to 35 MB total unified cache) for Haswell-EP and up to 40 MB for Haswell-EX.
It is likely that LGA 2011-3 replaces LGA 2011 for Haswell EP. The new socket has the
same number of pins, but is incompatible electrically and thus is keyed differently.
The already launched Xeon E3 v3 Haswells will get a refresh in Spring 2014. These also get
a refreshed Intel C220 series PCH chipset. TDP up to 160 W for Haswell-EP.
Haswell Refresh According to Intel roadmaps, Broadwell will
be released in first half of 2015. Thus, Intel scheduled a refresh of Haswell, simply titled
"Haswell Refresh", for the middle of 2014, which offers modest clock bumps over existing
parts. These new parts would also be compatible with the new Intel's 9 Series chipsets. Later
it was also revealed that overclockable parts, codenamed "Devil's Canyon", would employ a
new and improved thermal interface material, which would improve their overclocking potential
as something that had been problematic since the introduction of Ivy Bridge. Intel also
announced plans to mark the occasion by releasing the new Pentium Anniversary Edition, which
would include an unlocked version. List of Haswell processors
Desktop processors
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, F16C, BMI1+BMI2, Enhanced
Intel SpeedStep Technology, Intel 64, XD bit, Intel VT-x, and Smart Cache.
Core i3, i5, i7 support AVX, AVX2, FMA3 and AES-NI.
Core i5 and i7 support Turbo Boost 2.0. Core i3 and i7 support Hyper-threading. The
dual-core Core i5 4570T and 4570TE also support HT.
SKUs below 45xx as well as R-series and K-series SKUs, excluding the i5-4690K and i7-4790K,
do not support TSX SKUs below 45xx as well as R-series and K-series
SKUs do not support Trusted Execution Technology or vPro.
Intel VT-d, Intel's IOMMU, is supported on i5 and i7 except K models below 5xxx.
Models i5-4690K and i7-4790K, codenamed Devil's Canyon, have improved packaging to help heat
escape.
Transistors: 1.4 billion Die size: 177 mm2
Intel HD and Iris Graphics in following variants: R-series desktop processors feature Intel
Iris Pro 5200 graphics. All other currently known i3, i5 and i7 desktop
processors include Intel HD 4600 graphics. The exceptions are processors 41xxx, which
include HD 4400 graphics. Celeron and Pentium processors contain Intel
HD Graphics.
Haswell-based desktop Celerons are planned for the first quarter of 2014.
Pentium G3258 has an unlocked multiplier. List of announced desktop processors is as
follows: Requires a compatible motherboard.
Suffixes to denote: K – Unlocked
S – Performance-optimized lifestyle T – Power-optimized lifestyle
R – BGA packaging / High-performance GPU) X – Extreme performance
Server processors All models support: MMX, SSE, SSE2, SSE3,
SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, BMI+BMI2, Enhanced Intel SpeedStep Technology,
Intel 64, XD bit, TXT, Intel vPro, Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost 2.0,
AES-NI, Smart Cache, and TSX. List of launched server processors:
Requires a compatible motherboard. Suffixes to denote:
L – Low power Mobile processors
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C,
BMI1, BMI2, Enhanced Intel SpeedStep Technology, Intel VT-x, Intel 64, XD bit, Turbo Boost
2.0, and Smart Cache. Platform Controller Hub integrated into the
CPU package, slightly reducing the amount of space used on motherboards.
List of announced mobile processors as follows: When a cooler or quieter mode of operation
is desired, this mode specifies a lower TDP and lower guaranteed frequency versus the
nominal mode. This is the processor's rated frequency and
TDP. When extra cooling is available, this mode
specifies a higher TDP and higher guaranteed frequency versus the nominal mode.
Suffixes to denote: M – Mobile processor
Q – Quad-core U – Ultra-low power
X – "Extreme" Y – Extreme low-power
E / H – BGA1364 packaging Roadmap
The Skylake microarchitecture will be the successor to the Haswell and Broadwell architectures.
See also List of Intel CPU microarchitectures
Lynx Point LGA 1150: Original Haswell chipsets
References
External links "Intel Haswell Architecture Disclosure: Live
Blog". AnandTech. September 11, 2012. "4th Generation of Core Microarchitecture:
Intel Haswell". X-bit labs. September 12, 2012.
"Intel Core "Haswell" Desktop Processor Box Pricing Compiled". TechPowerUp. April 23,
2013. "XtremeSystems OC Examples". Charles Wirth.
June 1, 2013. "Intel Core i7-4770K CPU Review. Intel Haswell
for Desktops: Ruin of Our Hopes?". X-bit labs. June 1, 2013.
"Overview of Power Management for 3rd generation Ultrabook Platform, Haswell". AnandTech Forums.
2013-10-15. Per Hammarlund. "4th Generation Intel Core
Processor, codenamed Haswell".